From:
https://www.sciencedaily.com/releases/2026/05/260530053412.htm
New 3D silicon chip breakthrough could extend Moore?s Law for years
Date:
May 30, 2026
Source:
University of Illinois Grainger College of Engineering
Summary:
As traditional chip miniaturization slows, researchers have found a way
to pack more computing power into the same space by stacking silicon
circuits in multiple layers.
The new process uses ultra-thin silicon membranes and low-temperature
manufacturing techniques to overcome a major obstacle that has long
blocked the production of true 3D chips.
Will it work?
dissipation?
From:
https://www.sciencedaily.com/releases/2026/05/260530053412.htm
New 3D silicon chip breakthrough could extend Moore?s Law for years
Date:
May 30, 2026
Source:
University of Illinois Grainger College of Engineering
Summary:
As traditional chip miniaturization slows, researchers have found a way to
pack more computing power into the same space by stacking silicon circuits
in multiple layers.
The new process uses ultra-thin silicon membranes and low-temperature
manufacturing techniques to overcome a major obstacle that has long
blocked the production of true 3D chips.
Will it work?
dissipation?
Glen Walpert <nospam@null.void>wrote:
On Wed, 03 Jun 2026 13:00:21 GMT, Jan Panteltje wrote:
From:
https://www.sciencedaily.com/releases/2026/05/260530053412.htm
New 3D silicon chip breakthrough could extend Moore?s Law for years
Date:
May 30, 2026
Source:
University of Illinois Grainger College of Engineering
Summary:
As traditional chip miniaturization slows, researchers have found a way
to pack more computing power into the same space by stacking silicon
circuits in multiple layers.
The new process uses ultra-thin silicon membranes and low-temperature
manufacturing techniques to overcome a major obstacle that has long
blocked the production of true 3D chips.
Will it work?
dissipation?
Zeiss video showing 3D memory in volume production starting 2015:
(starts around 5 minutes in)
https://www.youtube.com/watch?v=H6iL_oE6z5A
Advantage of new method not at all clear from sciencedaily article.
Zeiss has a bunch of entertaining videos on lithography including latest >generation of EUV.:
https://www.youtube.com/watch?v=z6c3vzIGo9o
Carl <carl.ijamesXX@YYverizon.net>wrote:
On 6/3/26 9:00 AM, Jan Panteltje wrote:
From:
https://www.sciencedaily.com/releases/2026/05/260530053412.htm
New 3D silicon chip breakthrough could extend Moore?s Law for years
Date:
May 30, 2026
Source:
University of Illinois Grainger College of Engineering
Summary:
As traditional chip miniaturization slows, researchers have found a way to >> pack more computing power into the same space by stacking silicon circuits >> in multiple layers.
The new process uses ultra-thin silicon membranes and low-temperature
manufacturing techniques to overcome a major obstacle that has long
blocked the production of true 3D chips.
Will it work?
dissipation?
Last week Huawei announced this (from brave search):
"Huawei has unveiled the LogicFolding chip architecture and the Tau
Scaling Law, a new design framework intended to bypass US sanctions by >focusing on signal propagation speed rather than traditional transistor >miniaturization. This approach aims to achieve transistor density
equivalent to 1.4nm chips by 2031, though the immediate commercial >application will be the Kirin 2026 smartphone chip launching in fall 2026."
Reuters has a decent article, and I've seen at least one youtube video
on it that I'm pretty sure said they had working prototype chips now and >expect full production this fall. Wonder how the UI process compares?
From:
https://www.sciencedaily.com/releases/2026/05/260530053412.htm
New 3D silicon chip breakthrough could extend Moore?s Law for years
Date:
May 30, 2026
Source:
University of Illinois Grainger College of Engineering
Summary:
As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits
in multiple layers.
The new process uses ultra-thin silicon membranes and low-temperature manufacturing techniques to overcome a major obstacle that has long
blocked the production of true 3D chips.
Will it work?
dissipation?
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